wedge bonding
英 [wedʒ ˈbɒndɪŋ]
美 [wedʒ ˈbɑːndɪŋ]
楔形接合（点）；楔（形）焊（点）
双语例句
- Reducing the first bond heel crack is the most important in improving the tensile strength of bonding wire in automatic wedge bonding.
在自动楔焊键合中，要提高键合引线的抗拉强度，最重要的一点就是要减小第一键合点跟部的损伤。 - Ultrasonic wedge bonding is one of the most important interconnection techniques for IC dies inner circuits with the outer world for the power and signal transportation.
封装制程中超音波焊线楔形接合，是将IC晶片与外部电路连接的一种互相连系技术，并能提供电能输入和讯号沟通的功能。 - Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响 - The Web GIS is the organic wedge bonding of the GIS and the Internet, it makes the GIS expand from expert system to the square aspect noodles of the society and become a popularized information tool.
WebGIS是GIS与Internet网络的有机结合，它使GIS的应用领域从专家系统扩展到社会的方方面面，成为了大众化的信息工具。 - Effect of bonding time on thick aluminum wire wedge bonding strength
键合时间对粗铝丝超声引线键合强度的影响 - The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
试验研究了不同超声功率条件下，键合时间对粗铝丝引线键合强度的影响规律。 - Analysis on characteristics of input power and interface wedge bonding of Al-Ni ultrasonic aluminum wedge bonds
Al-Ni超声楔焊中输入功率与界面键合的特征分析 - Some studies have shown that copper wires may serve as a viable, cost-effective alternative to gold in some high-end, ball and wedge bonding applications.
一些研究表明，铜线具有比金线更好的机械性能和电学性能，且价格比金线便宜。这些优势使铜线可代替金线用于一些高引出端、细间距的球焊和楔型焊的半导体器件中。 - This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。 - The effect of ultrasonic power on large aluminum wire wedge bonding strength is stud-ied by changing the ultrasonic power rate, which is defined as the rate between set and maximum ultrasonic power.
在这种典型的工业工艺键合参数下，通过改变超声功率比（设定超声功率与最大可调功率之比）来改变超声功率，研究了超声功率对引线键合强度的影响规律。 - The influences of ultrasonic power on heavy aluminum wire wedge bonding strength were investigated.
超声功率是影响粗铝丝引线键合强度的最主要因素之一。 - Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire
Cu丝超声球焊及楔焊焊点可靠性及失效机理研究 - Evolution of the Bond Interface During Ultrasonic Wedge Bonding Process
超声楔键合过程界面接合部演化规律研究 - Structure characteristics and evolution at wedge bonding interface
Ni-Al超声楔焊键合分离界面的结构特性及演变规律 - From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。